The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2019
Filed:
Mar. 31, 2016
Applicant:
Evonik Degussa Gmbh, Essen, DE;
Inventors:
Matthias Geisler, Grosskrotzenburg, DE;
Frank Menzel, Hanau, DE;
Assignee:
Evonik Degussa GmbH, Essen, DE;
Primary Examiner:
Int. Cl.
CPC ...
C04B 41/00 (2006.01); C04B 30/02 (2006.01); C04B 41/45 (2006.01); C04B 41/49 (2006.01); C04B 41/60 (2006.01); C04B 41/64 (2006.01);
U.S. Cl.
CPC ...
C04B 30/02 (2013.01); C04B 41/009 (2013.01); C04B 41/4519 (2013.01); C04B 41/4944 (2013.01); C04B 41/60 (2013.01); C04B 41/64 (2013.01);
Abstract
A process for producing an ammonia-treated hydrophilic thermal insulation molding which includes treating a thermal insulation molding containing hydrophilic silica with ammonia by introducing the thermal insulation molding into a chamber and supplying gaseous ammonia until a pressure difference Δp of ≥20 mbar is achieved. A process for producing a thermal insulation molding containing hydrophobic silica which includes treating the ammonia-treated hydrophilic thermal insulation molding with an organosilicon compound.