The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 2019

Filed:

May. 03, 2017
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Sasha Marjanovic, Painted Post, NY (US);

Garrett Andrew Piech, Corning, NY (US);

Sergio Tsuda, Horseheads, NY (US);

Robert Stephen Wagner, Corning, NY (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); C03B 33/02 (2006.01); B32B 17/06 (2006.01); B23K 26/53 (2014.01); B23K 26/55 (2014.01); B23K 26/06 (2014.01); B23K 26/073 (2006.01); B23K 26/00 (2014.01); B23K 26/0622 (2014.01); B23K 26/40 (2014.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
C03B 33/0222 (2013.01); B23K 26/0006 (2013.01); B23K 26/0613 (2013.01); B23K 26/0624 (2015.10); B23K 26/0738 (2013.01); B23K 26/40 (2013.01); B23K 26/53 (2015.10); B23K 26/55 (2015.10); B32B 17/06 (2013.01); B23K 2103/50 (2018.08); B32B 2250/02 (2013.01); B32B 2315/02 (2013.01); Y02P 40/57 (2015.11); Y10T 428/21 (2015.01); Y10T 428/24273 (2015.01); Y10T 428/24355 (2015.01);
Abstract

A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.


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