The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 2019

Filed:

Dec. 12, 2005
Applicant:

Rubinder Randhawa, Fremont, CA (US);

Inventor:

Rubinder Randhawa, Fremont, CA (US);

Assignee:

Planar Semiconductor, Inc., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05B 1/04 (2006.01); B08B 3/02 (2006.01); B05B 1/06 (2006.01); B05B 1/34 (2006.01); B05B 7/04 (2006.01); B05B 12/02 (2006.01); B05B 13/04 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B08B 3/024 (2013.01); B05B 1/044 (2013.01); B05B 1/06 (2013.01); B05B 1/341 (2013.01); B05B 7/0433 (2013.01); B05B 12/02 (2013.01); B05B 13/0405 (2013.01); B05B 13/0442 (2013.01); H01L 21/67051 (2013.01);
Abstract

A method and apparatus for pulsed jet cleaning of flat objects based on the principle of enhancing formation of droplets of the cleaning medium by increasing the boundary surface area between the jets emitted though the nozzles of the cleaning unit and the surrounding atmosphere. In various embodiments of the invention, these droplet formation enhancement means are located inside the nozzle at the nozzle outlet end and are made in the form of a jet splitter, threaded grooves on the inner surface of the nozzle body, or in the form of a thin tube for the supply of gas into the flow of the liquid cleaning medium for the formation of gas bubbles in the medium. The method also takes into account such factors as a mass ratio between the droplets and the contaminant particles, velocity of droplets, organization and sequence of jets that attacks the surface of the wafer and flows that wash-out the separated particles, etc.


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