The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
May. 08, 2012
Applicant:
Kazuki Kammuri, Ibaraki, JP;
Inventor:
Kazuki Kammuri, Ibaraki, JP;
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); H05K 1/09 (2006.01); B21D 33/00 (2006.01); C22F 1/08 (2006.01); C22C 9/00 (2006.01); B32B 15/20 (2006.01); B32B 15/08 (2006.01); H05K 9/00 (2006.01); C22C 9/02 (2006.01); C22C 9/04 (2006.01); B32B 27/28 (2006.01); B32B 27/32 (2006.01); B32B 7/12 (2006.01); B32B 27/00 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0084 (2013.01); B21D 33/00 (2013.01); B32B 7/12 (2013.01); B32B 15/01 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/281 (2013.01); B32B 27/32 (2013.01); C22C 9/00 (2013.01); C22C 9/02 (2013.01); C22C 9/04 (2013.01); C22F 1/08 (2013.01); H05K 1/09 (2013.01); B32B 2255/06 (2013.01); B32B 2307/208 (2013.01); B32B 2307/212 (2013.01); B32B 2307/546 (2013.01); B32B 2457/00 (2013.01); B32B 2457/20 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0358 (2013.01); Y10T 29/30 (2015.01); Y10T 428/12431 (2015.01); Y10T 428/31678 (2015.04);
Abstract
A copper foil composite comprising a copper foil and a resin layer laminated, the copper foil containing at least one selected from the group consisting of Sn, Mn, Cr, Zn, Zr, Mg, Ni, Si and Ag at a total of 30 to 500 mass ppm, a tensile strength of the copper foil having of 100 to 180 MPa, a degree of aggregation I200/I200 of a (100) plane of the copper foil being 30 or more, and an average grain size viewed from a plate surface of the copper foil being 10 to 400 μm.