The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

Jul. 20, 2015
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Defeng Mao, Beijing, CN;

Yanbing Wu, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/30 (2006.01); G02F 1/1345 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/111 (2013.01); H05K 3/301 (2013.01); G02F 1/13452 (2013.01); H05K 3/341 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10287 (2013.01); H05K 2201/10318 (2013.01); H05K 2203/049 (2013.01); Y02P 70/611 (2015.11);
Abstract

The embodiments of present invention disclose a circuit board and a manufacturing method thereof and a display apparatus comprising the circuit board. The circuit board comprises a base substrate, a device to be soldered, a bonding pad and a support, wherein the bonding pad and the support are provided on the base substrate, and the device to be soldered is provided on the support and is connected with the bonding pad. By providing the device to be soldered on the support, the embodiments of present invention can effectively prevent the short circuit of the device to be soldered during the process of soldering and thus improve product yield.


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