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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10178767 B1

PDFFull Text
Date of Patent:
Jan. 08, 2019

Filed:

Nov. 27, 2013

Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board

Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Tomo Chiba, Tokyo, JP;

Hiroshi Takahashi, Tokyo, JP;

Eisuke Shiga, Tokyo, JP;

Yoshihiro Kato, Tokyo, JP;

Assignee:

MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Christopher M Polley

Int. Cl.
CPC ...
B32B 3/10 (2006.01); H05K 1/03 (2006.01); H05K 1/05 (2006.01); C08J 5/24 (2006.01); C08L 63/00 (2006.01); C08F 283/12 (2006.01); C08L 51/08 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); C08G 59/24 (2006.01); C08G 59/32 (2006.01); C08K 3/36 (2006.01); C08L 79/04 (2006.01); C08G 73/06 (2006.01); C08L 61/06 (2006.01); C08L 79/08 (2006.01); C08K 5/315 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0353 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08F 283/124 (2013.01); C08G 59/245 (2013.01); C08G 59/3218 (2013.01); C08J 5/24 (2013.01); C08K 3/36 (2013.01); C08L 51/085 (2013.01); C08L 63/00 (2013.01); C08L 79/04 (2013.01); H05K 1/056 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2264/102 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B32B 2307/3065 (2013.01); B32B 2307/714 (2013.01); B32B 2457/08 (2013.01); C08G 73/0655 (2013.01); C08J 2363/00 (2013.01); C08J 2463/04 (2013.01); C08J 2479/00 (2013.01); C08J 2483/07 (2013.01); C08K 5/315 (2013.01); C08L 61/06 (2013.01); C08L 79/085 (2013.01); C08L 2203/20 (2013.01); C08L 2205/035 (2013.01); H05K 1/0366 (2013.01); H05K 1/0373 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/0209 (2013.01); Y10T 428/24802 (2015.01); Y10T 428/249921 (2015.04); Y10T 428/2962 (2015.01); Y10T 442/2951 (2015.04);
Abstract

An object of the present invention is to provide a resin composition that has a variety of properties required for a material for printed circuit boards such as high flame retardancy, and can attain a cured product having high moldability, high resistance against chemicals in a desmearing step, and a small coefficient of thermal expansion, a prepreg comprising the resin composition, a laminate including the prepreg, a metallic foil clad laminate including the prepreg, and a printed circuit board including the prepreg. A resin composition comprising an acrylic-silicone copolymer (A), a halogen-free epoxy resin (B), a cyanic acid ester compound (C) and/or a phenol resin (D), and an inorganic filler (E).

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