The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Jan. 09, 2018
Applicant:
Lsis Co., Ltd., Anyang-si, Gyeonggi-do, KR;
Inventors:
Deok-Young Lim, Anyang-si, KR;
Chun-Suk Yang, Anyang-si, KR;
Assignee:
LSIS CO., LTD., Anyang-si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/02 (2006.01); H05K 3/32 (2006.01); H02M 1/44 (2007.01); H05K 3/22 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0239 (2013.01); H02M 1/44 (2013.01); H05K 1/0215 (2013.01); H05K 1/0216 (2013.01); H05K 1/0233 (2013.01); H05K 1/0243 (2013.01); H05K 1/0256 (2013.01); H05K 1/0263 (2013.01); H05K 3/222 (2013.01); H05K 3/32 (2013.01); H05K 2201/10409 (2013.01);
Abstract
Disclosed herein is a board apparatus including a printed circuit board, including a first ground wiring disposed on one surface of the printed circuit board; a second ground wiring disposed on the other surface of the printed circuit board; and a switch module disposed in an overlapped region between the first ground wiring and the second ground wiring, and including a bolt which penetrates through the printed circuit board and a nut which is in contact with the second ground wiring and is coupled to a screw of the bolt.