The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

Mar. 09, 2016
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibraraki, JP;

Inventors:

Yuta Numakura, Hitachinaka, JP;

Akira Ishii, Hitachinaka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/02 (2006.01); H02M 7/00 (2006.01); H02M 7/48 (2007.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H02M 7/003 (2013.01); H02M 7/48 (2013.01); H05K 7/02 (2013.01); H05K 7/2089 (2013.01); H05K 7/20845 (2013.01);
Abstract

An object of the present invention is to achieve reduction in height of an electric power conversion device while maintaining high performance of the electric power conversion device. An electric power conversion device according to the present invention includes: a first power semiconductor module, a second power semiconductor module, a third power semiconductor module, and an AC circuit body that transmits and detects U-phase, V-phase, and W-phase AC currents, and when a direction along an arrangement direction of the first power semiconductor module and the second power semiconductor module is defined as a first column, the third power semiconductor module and the AC circuit body are disposed along a second column being in a direction parallel to the first column, and the AC circuit body is disposed in a space that is in a direction orthogonal to the first column and faces the second power semiconductor module, and is in a direction parallel to the second column and faces the third power semiconductor module.


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