The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

Mar. 25, 2015
Applicants:

Autonetworks Technologies, Ltd., Yokkaichi-shi, Mie, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi-shi, Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Inventors:

Yoshifumi Saka, Mie, JP;

Masayuki Ookubo, Mie, JP;

Hajime Watanabe, Mie, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); H01R 13/03 (2006.01); H01R 13/04 (2006.01); H01R 13/11 (2006.01); C25D 5/10 (2006.01); C25D 5/50 (2006.01); C25D 5/02 (2006.01);
U.S. Cl.
CPC ...
H01R 13/03 (2013.01); C25D 5/10 (2013.01); C25D 5/505 (2013.01); H01R 13/04 (2013.01); H01R 13/113 (2013.01); C25D 5/022 (2013.01);
Abstract

A terminal pair including a first terminal provided with a first contact portion and a second terminal provided with a second contact portion. The first contact portion includes a composite covering layer having a Sn—Pd based alloy phase and a Sn phase, and has a surface including the Sn—Pd based alloy phase and the Sn phase. The second contact portion includes a Cu—Sn alloy layer and a Sn layer covering part of the Cu—Sn alloy layer, and has a surface including a Cu—Sn alloy region corresponding to an exposed portion of the Cu—Sn alloy layer and a Sn region corresponding to an exposed portion of the Sn layer. A coefficient of friction for sliding movement between the first contact portion and the second contact portion is lower than a coefficient of friction for sliding movement between the two first contact portions and between the two second contact portions.


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