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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10177478 B1

PDFFull Text
Date of Patent:
Jan. 08, 2019

Filed:

Oct. 22, 2014

Board terminal and board connector

Applicants:

Autonetworks Technologies, Ltd., Yokkaichi, Mie, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Inventors:

Hajime Watanabe, Mie, JP;

Yasushi Saitoh, Mie, JP;

Yoshifumi Saka, Mie, JP;

Assignees:

AUTONETWORKS TECHNOLOGIES, LTD., Yokkaichi, Mie, JP;

SUMITOMO WIRING SYSTEMS, LTD., Yokkaichi, Mie, JP;

SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka-Shi, Osaka, JP;

Attorneys:

Gerald E. Hespos

Michael J. Porco

Matthew T. Hespos

Primary Examiner:

Seth Dumbris

Int. Cl.
CPC ...
B32B 15/01 (2006.01); H01R 13/03 (2006.01); C25D 7/00 (2006.01); C25D 5/12 (2006.01); C25D 5/50 (2006.01); H01R 12/71 (2011.01); H01R 43/16 (2006.01); H01R 12/58 (2011.01); H01R 12/72 (2011.01); H01R 107/00 (2006.01);
U.S. Cl.
CPC ...
H01R 13/03 (2013.01); C25D 5/12 (2013.01); C25D 5/505 (2013.01); C25D 7/00 (2013.01); H01R 12/716 (2013.01); H01R 43/16 (2013.01); H01R 12/58 (2013.01); H01R 12/724 (2013.01); H01R 2107/00 (2013.01); Y10T 428/12708 (2015.01); Y10T 428/12715 (2015.01); Y10T 428/12785 (2015.01); Y10T 428/24917 (2015.01);
Abstract

A board terminalincludes a base materialmade of a metal material and a plating filmcovering a surface of the base materialThe plating filmincludes an outermost layerhaving a Sn mother phaseand Sn—Pd-based alloy phasesdispersed in the Sn mother phasethe Sn mother phaseand the Sn—Pd-based alloy phasesbeing present on an outer surface. A Pd content in the outermost layeris not more than 7 atomic %. A board connectorincludes the board terminaland a housingfor holding the board terminal

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