The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Jul. 12, 2017
Applicant:
Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;
Inventors:
Xiaozhi Fu, Shanghai, CN;
Ming Shi, Shanghai, CN;
Xiang Xu, Shanghai, CN;
Wei Zhang, Shanghai, CN;
Cui Li, Shanghai, CN;
Assignee:
Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 9/05 (2006.01); H01R 12/73 (2011.01); H01R 12/70 (2011.01); H01R 12/91 (2011.01); H01R 13/58 (2006.01); H01R 12/57 (2011.01); H01R 13/11 (2006.01); H01R 4/48 (2006.01);
U.S. Cl.
CPC ...
H01R 12/73 (2013.01); H01R 12/57 (2013.01); H01R 12/707 (2013.01); H01R 12/732 (2013.01); H01R 12/91 (2013.01); H01R 13/11 (2013.01); H01R 13/5812 (2013.01); H01R 13/5829 (2013.01); H01R 4/4836 (2013.01);
Abstract
A connector assembly comprises a first connector and a second connector. The first connector consists of a first monolithically formed conductive terminal adapted to be soldered onto a first circuit board. The second connector consists of a second monolithically formed conductive terminal adapted to be soldered onto a second circuit board. The first connector mates with the second connector to electrically connect the first circuit board to the second circuit board.