The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Jul. 01, 2016
Applicant:
Sharp Kabushiki Kaisha, Sakai, Osaka, JP;
Inventors:
Yuki Yasuda, Sakai, JP;
Tetsunori Tanaka, Sakai, JP;
Assignee:
SHARP KABUSHIKI KAISHA, Sakai, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/56 (2006.01); G02F 1/1339 (2006.01); H01L 51/50 (2006.01); H01L 27/32 (2006.01); H05B 33/02 (2006.01); H05B 33/04 (2006.01); H05B 33/06 (2006.01); H05B 33/10 (2006.01); G02F 1/1335 (2006.01); G02F 1/1368 (2006.01); H01L 27/12 (2006.01); H01L 51/52 (2006.01); H01L 51/00 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
H01L 51/56 (2013.01); G02F 1/1333 (2013.01); G02F 1/1339 (2013.01); G02F 1/1368 (2013.01); G02F 1/133305 (2013.01); G02F 1/133512 (2013.01); G02F 1/133514 (2013.01); H01L 27/1251 (2013.01); H01L 27/32 (2013.01); H01L 27/322 (2013.01); H01L 27/3248 (2013.01); H01L 51/003 (2013.01); H01L 51/0097 (2013.01); H01L 51/50 (2013.01); H01L 51/5012 (2013.01); H01L 51/5056 (2013.01); H01L 51/5072 (2013.01); H01L 51/5092 (2013.01); H01L 51/5246 (2013.01); H01L 51/5284 (2013.01); H05B 33/02 (2013.01); H05B 33/04 (2013.01); H05B 33/06 (2013.01); H05B 33/10 (2013.01); G02F 2201/121 (2013.01); G02F 2201/123 (2013.01);
Abstract
In a substrate bonding step of bonding an element original substrate to a counter original substrate through an intermediate layer so that a thin film element layer and a terminal group formed in the element original substrate face a second resin substrate layer formed in the counter original substrate, to manufacture a substrate bonded body, a terminal portion sealing member is formed in a frame shape surrounding the terminal group between the element original substrate and the counter original substrate.