The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Oct. 30, 2014
Applicant:
Boe Technology Group Co., Ltd., Beijing, CN;
Inventors:
Assignee:
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); H01L 51/52 (2006.01); C03C 3/21 (2006.01); C03C 8/10 (2006.01); C03C 8/18 (2006.01); C03C 12/00 (2006.01); C03C 8/08 (2006.01); C03C 3/14 (2006.01); C03C 8/16 (2006.01); C09D 17/00 (2006.01); C08K 3/40 (2006.01); C09D 1/00 (2006.01); C09D 5/34 (2006.01); C09D 7/61 (2018.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5237 (2013.01); C03C 3/142 (2013.01); C03C 3/21 (2013.01); C03C 8/08 (2013.01); C03C 8/10 (2013.01); C03C 8/16 (2013.01); C03C 8/18 (2013.01); C03C 12/00 (2013.01); C08K 3/40 (2013.01); C09D 1/00 (2013.01); C09D 5/34 (2013.01); C09D 7/61 (2018.01); C09D 17/002 (2013.01); C09D 17/006 (2013.01); H01L 51/5246 (2013.01); C08K 2003/085 (2013.01);
Abstract
The present invention provides a glass powder blend comprising glass powder and additives, wherein the additives comprise copper powder, and the copper powder accounts for 2-3 mass % based on the total amount of the glass powder blend in 100 mass %. The present invention also provides a glass powder paste and a photoelectric package. Due to the addition of copper powder to the glass powder, the melting point of the glass powder blend can be decreased, thereby lowering the temperature for melting the glass powder blend by using laser, and reducing the thermal stress generated during encapsulation.