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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10177294 B1

PDFFull Text
Date of Patent:
Jan. 08, 2019

Filed:

Oct. 19, 2016

Illumination apparatus

Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Min Hak Kim, Seoul, KR;

Do Yub Kim, Seoul, KR;

Myung Jin Song, Seoul, KR;

Assignee:

LG INNOTEK CO., LTD., Seoul, KR;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Mariceli Santiago

Int. Cl.
CPC ...
F21S 8/02 (2006.01); F21V 29/77 (2015.01); F21V 29/503 (2015.01); F21S 8/06 (2006.01); H01L 33/64 (2010.01); H01L 33/48 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); F21V 15/01 (2006.01); F21V 23/00 (2015.01); F21V 21/08 (2006.01); F21Y 115/10 (2016.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 33/644 (2013.01); F21S 8/026 (2013.01); F21S 8/06 (2013.01); F21V 15/01 (2013.01); F21V 21/0832 (2013.01); F21V 23/005 (2013.01); F21V 29/503 (2015.01); F21V 29/773 (2015.01); H01L 33/483 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); F21Y 2115/10 (2016.08); H05K 1/0209 (2013.01); H05K 2201/066 (2013.01); H05K 2201/09781 (2013.01); H05K 2201/10106 (2013.01);
Abstract

Embodiments provide an illumination apparatus including a light emitting module including a board, at least one light emitting device disposed in a first region of the board and drive devices disposed in a second region of the board, a heat dissipation member, and dummy pads disposed around the at least one light emitting device, the heat dissipation member including a base, a core, and heat dissipation fins connected to the side surface of the core and the lower surface of the base. The first region is one region of the upper surface of the board, located within a designated range from the center of the board, and the second region is another region of the upper surface of the board, spaced apart from the first region by a first distance and spaced apart from the edge of the upper surface of the board by a second distance.

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