The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

Dec. 07, 2016
Applicant:

Nichia Corporation, Anan-shi, JP;

Inventors:

Mayumi Fukuda, Tokushima, JP;

Tomohisa Kishimoto, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 23/495 (2006.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 23/49575 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 33/647 (2013.01); H01L 2224/48247 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method for manufacturing a package includes a step of injecting a first resin through an injection port of a dies in which a lead frame has been placed. The method includes a step of cutting out a portion of a border between a first electrode and a first connection portion running through a first through hole, and cutting out a portion of a border between a second electrode and a second connection portion running through a second through hole after molding the first resin. The method includes a step of electroplating the first and second electrodes. The method includes a step of cutting out a remaining portion of the border between the first electrode and the first connection portion, and cutting out a remaining portion of the border between the second electrode and the second connection portion.


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