The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

Dec. 22, 2017
Applicant:

Xi'an Creation Keji Co., Ltd., Xi'an, CN;

Inventors:

Liang Zhang, Xi'an, CN;

Yu Zuo, Xi'an, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/08 (2006.01); H01Q 7/00 (2006.01); H01L 21/822 (2006.01); H01L 21/762 (2006.01); H01L 21/265 (2006.01); H01L 21/3065 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 21/324 (2006.01); H01L 27/12 (2006.01); H01L 29/06 (2006.01); H01L 29/04 (2006.01); H01L 29/165 (2006.01); H01L 29/868 (2006.01); H01L 29/66 (2006.01); H01L 21/306 (2006.01); H01Q 23/00 (2006.01); H01L 21/84 (2006.01); H01Q 13/08 (2006.01); H01Q 5/328 (2015.01);
U.S. Cl.
CPC ...
H01L 27/0814 (2013.01); H01L 21/0217 (2013.01); H01L 21/0262 (2013.01); H01L 21/02164 (2013.01); H01L 21/02236 (2013.01); H01L 21/02532 (2013.01); H01L 21/02595 (2013.01); H01L 21/26513 (2013.01); H01L 21/3065 (2013.01); H01L 21/30625 (2013.01); H01L 21/31111 (2013.01); H01L 21/324 (2013.01); H01L 21/76283 (2013.01); H01L 21/822 (2013.01); H01L 21/84 (2013.01); H01L 27/1203 (2013.01); H01L 29/04 (2013.01); H01L 29/0649 (2013.01); H01L 29/165 (2013.01); H01L 29/6609 (2013.01); H01L 29/868 (2013.01); H01Q 5/328 (2015.01); H01Q 7/00 (2013.01); H01Q 13/08 (2013.01); H01Q 23/00 (2013.01);
Abstract

A preparation method for a SiGe based plasma p-i-n diode string for a sleeve antenna is provided. The preparation method includes: selecting a SiGeOI substrate with a certain crystal orientation and forming isolation regions on the SiGeOI substrate; etching the substrate to form P-type trenches and N-type trenches, depths of the P-type trenches and the N-type trenches each being smaller than a thickness of a top SiGe layer of the substrate; filling the P-type trenches and the N-type trenches and forming P-type active regions and N-type active regions in the top SiGe layer of the substrate by an ion implantation process; and forming leads on the substrate so as to obtain the heterogeneous SiGe based plasma p-i-n diode. Therefore, a high-performance heterogeneous SiGe based plasma p-i-n diode suitable for forming a solid-state plasma antenna is prepared by using a deep trench isolation technology and the ion implantation process.


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