The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

Aug. 18, 2017
Applicant:

Genesis Photonics Inc., Tainan, TW;

Inventors:

Shao-Ying Ting, New Taipei, TW;

Yan-Ting Lan, Tainan, TW;

Jing-En Huang, Tainan, TW;

Yi-Ru Huang, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 27/15 (2006.01); H01L 33/06 (2010.01); H01L 33/60 (2010.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 24/97 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 2221/68336 (2013.01); H01L 2221/68363 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81805 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/95001 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method of mass transferring electronic devices includes following steps. A wafer is provided. The wafer includes a substrate and a plurality of electronic devices. The electronic devices are arranged in a matrix on a surface of the substrate. The wafer is attached to a temporary fixing film. The wafer is cut so that the wafer is divided into a plurality of blocks. Each of the blocks includes at least a part of the electronic devices and a sub-substrate. The temporary fixing film is stretched so that the blocks on the temporary fixing film are separated from each other as the temporary fixing film is stretched. At least a part of the blocks is selected as a predetermined bonding portion, and each of the blocks in the predetermined bonding portion is transferred to a carrying substrate in sequence, so that the electronic devices in the predetermined bonding portion arc bonded to the carrying substrate. The sub-substrates of the blocks are removed. Another method of mass transferring electronic devices is also provided.


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