The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

Aug. 01, 2016
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventor:

Rafael C. Camarota, San Jose, CA (US);

Assignee:

XILINX, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 24/09 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/5286 (2013.01); H01L 24/17 (2013.01); H01L 24/83 (2013.01); H01L 2224/0903 (2013.01); H01L 2224/0912 (2013.01); H01L 2224/1712 (2013.01);
Abstract

Methods and apparatus are described for strategically arranging conductive elements (e.g., solder balls) of an integrated circuit (IC) package (and the corresponding conductive pads of a circuit board for electrical connection with the IC package) using a plurality of different pitches. One example integrated circuit (IC) package generally includes an integrated circuit die and an arrangement of electrically conductive elements coupled to the integrated circuit die. In at least one region of the arrangement, the conductive elements are disposed with a first pitch in a first dimension of the arrangement and with a second pitch in a second dimension of the arrangement, and the second pitch is different from the first pitch. The pitch of a given region may be based on mechanical, PCB routing, and/or signal integrity considerations.


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