The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Jul. 20, 2017
Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Moon Il Kim, Suwon-si, KR;
Mi Jin Choi, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Abstract
A fan-out semiconductor package includes a first connection member having a through-hole, a semiconductor chip disposed in the through-hole of the first connection member, the semiconductor chip including an active surface having connection pads disposed thereon and an inactive surface opposing the active surface, a passive component attached to the active surface of the semiconductor chip, an encapsulant encapsulating at least a portion of the first connection member and the inactive surface of the semiconductor chip, and a second connection member disposed on the first connection member and the active surface of the semiconductor chip, the first connection member and the second connection member each including at least one redistribution layer electrically connected to the connection pads of the semiconductor chip, and the passive component being electrically connected to the connection pads of the semiconductor chip through the redistribution layer of the second connection member.