The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Nov. 06, 2015
Applicant:
Hitachi, Ltd., Tokyo, JP;
Inventors:
Nobutake Tsuyuno, Tokyo, JP;
Eiichi Ide, Tokyo, JP;
Assignee:
HITACHI, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/48 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/00 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/48 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 29/7395 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01);
Abstract
An object of the invention is to manufacture a semiconductor module small. A metal wire () connecting a control electrode () and a control terminal () rises to form a first angle (θ) from the control electrode () toward a first conductive portion (), gradually goes in substantially parallel to the first conductive portion () as the metal wire approaches the first conductive portion (), and is connected to the control terminal () to form a second angle (θ) smaller than the first angle (θ).