The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

Mar. 18, 2011
Applicants:

Hideo Nishikubo, Tokyo, JP;

Shunji Masumori, Tokyo, JP;

Takuya Harada, Tokyo, JP;

Tomohiro Ishii, Tokyo, JP;

Hidemichi Fujiwara, Tokyo, JP;

Inventors:

Hideo Nishikubo, Tokyo, JP;

Shunji Masumori, Tokyo, JP;

Takuya Harada, Tokyo, JP;

Tomohiro Ishii, Tokyo, JP;

Hidemichi Fujiwara, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/60 (2006.01); H05K 13/04 (2006.01); H01L 23/492 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4924 (2013.01); H01L 21/4853 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/27 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/1332 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13294 (2013.01); H01L 2224/13305 (2013.01); H01L 2224/13309 (2013.01); H01L 2224/13311 (2013.01); H01L 2224/13313 (2013.01); H01L 2224/13316 (2013.01); H01L 2224/13317 (2013.01); H01L 2224/13318 (2013.01); H01L 2224/13323 (2013.01); H01L 2224/13324 (2013.01); H01L 2224/13339 (2013.01); H01L 2224/13344 (2013.01); H01L 2224/13347 (2013.01); H01L 2224/13349 (2013.01); H01L 2224/13355 (2013.01); H01L 2224/13357 (2013.01); H01L 2224/13364 (2013.01); H01L 2224/13366 (2013.01); H01L 2224/13369 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/2747 (2013.01); H01L 2224/2932 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29305 (2013.01); H01L 2224/29309 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29313 (2013.01); H01L 2224/29316 (2013.01); H01L 2224/29317 (2013.01); H01L 2224/29318 (2013.01); H01L 2224/29323 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29349 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29357 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29366 (2013.01); H01L 2224/29369 (2013.01); H01L 2224/3201 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/81075 (2013.01); H01L 2224/8184 (2013.01); H01L 2224/81125 (2013.01); H01L 2224/81127 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/83075 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83125 (2013.01); H01L 2224/83127 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83447 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01009 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01021 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/351 (2013.01); H05K 2203/0338 (2013.01);
Abstract

A conductive connecting member formed on a bonded face of an electrode terminal of a semiconductor or an electrode terminal of a circuit board, the conductive connecting member comprising a porous body formed in such manner that a conductive paste containing metal fine particles (P) having mean primary particle diameter from 10 to 500 nm and an organic solvent (S), or a conductive paste containing the metal fine particles (P) and an organic dispersion medium (D) comprising the organic solvent (S) and an organic binder (R) is heating-treated so as for the metal fine particles (P) to be bonded, the porous body being formed by bonded metal fine particles (P) having mean primary particle diameter from 10 to 500 nm, a porosity thereof being from 5 to 35 volume %, and mean pore diameter being from 1 to 200 nm.


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