The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Sep. 09, 2015
Hitachi, Ltd., Tokyo, JP;
Takashi Naito, Tokyo, JP;
Motomune Kodama, Tokyo, JP;
Takuya Aoyagi, Tokyo, JP;
Shigeru Kikuchi, Tokyo, JP;
Takashi Nogawa, Tokyo, JP;
Mutsuhiro Mori, Tokyo, JP;
Eiichi Ide, Tokyo, JP;
Toshiaki Morita, Tokyo, JP;
Akitoyo Konno, Tokyo, JP;
Taigo Onodera, Tokyo, JP;
Tatsuya Miyake, Tokyo, JP;
Akihiro Miyauchi, Tokyo, JP;
HITACHI LTD., Tokyo, JP;
Abstract
A heat-dissipating structure is formed by bonding a first member and a second member, each being any of a metal, ceramic, and semiconductor, via a die bonding member; or a semiconductor module formed by bonding a semiconductor chip, a metal wire, a ceramic insulating substrate, and a heat-dissipating base substrate including metal, with a die bonding member interposed between each. At least one of the die bonding members includes a lead-free low-melting-point glass composition and metal particles. The lead-free low-melting-point glass composition accounts for 78 mol % or more in terms of the total of the oxides V2O5, TeO2, and Ag2O serving as main ingredients. The content of each of TeO2 and Ag2O is 1 to 2 times the content of V2O5, and at least one of BaO, WO3, and P2O5 is included as accessory ingredients, and at least one of Y2O3, La2O3, and Al2O3 is included as additional ingredients.