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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10177068 B1

PDFFull Text
Date of Patent:
Jan. 08, 2019

Filed:

Mar. 11, 2014

Heat conductive insulating sheet, power module, and manufacturing method thereof

Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventors:

Kenji Mimura, Chiyoda-ku, JP;

Yurie Nakamura, Chiyoda-ku, JP;

Xiaohong Yin, Chiyoda-ku, JP;

Kazuhiro Tada, Chiyoda-ku, JP;

Assignee:

MITSUBISHI ELECTRIC CORPORATION, Chiyoda-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Frances Tischler

Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01); B29C 45/00 (2006.01); B29C 45/02 (2006.01); B29C 45/14 (2006.01); B29C 35/02 (2006.01); H01L 23/31 (2006.01); B29K 63/00 (2006.01); B29K 105/16 (2006.01); B29K 509/04 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3733 (2013.01); B29C 35/0288 (2013.01); B29C 45/0013 (2013.01); B29C 45/02 (2013.01); B29C 45/14 (2013.01); H01L 23/295 (2013.01); H01L 23/3737 (2013.01); H01L 23/4334 (2013.01); H01L 23/49575 (2013.01); H01L 24/29 (2013.01); B29C 45/14655 (2013.01); B29C 2045/14663 (2013.01); B29K 2063/00 (2013.01); B29K 2105/16 (2013.01); B29K 2509/04 (2013.01); B29K 2995/0007 (2013.01); B29K 2995/0013 (2013.01); B29L 2031/3481 (2013.01); H01L 23/3107 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/181 (2013.01);
Abstract

A method for manufacturing, by a transfer mold method, a power module equipped with a heat conductive insulating sheet in which an inorganic filler including secondary aggregated particles formed by aggregation of primary particles of scaly boron nitride is dispersed in a thermosetting resin, where curing of an uncured or semi-cured heat conductive insulating sheet during transfer molding is advanced under specific conditions. The method for manufacturing a power module equipped with a heat conductive insulating sheet has excellent thermal conductivity and electric insulation ability.

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