The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

Apr. 20, 2016
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Seong Min Chin, Suwon-si, KR;

Je Ik Moon, Suwon-si, KR;

Ye Eun Jung, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/40 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01G 4/30 (2006.01); H02M 3/04 (2006.01); H05K 1/18 (2006.01); H01F 17/00 (2006.01); H01G 4/228 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01G 4/40 (2013.01); H01F 17/0013 (2013.01); H01F 17/0033 (2013.01); H01F 27/292 (2013.01); H01G 4/30 (2013.01); H05K 1/181 (2013.01); H01G 4/228 (2013.01); H05K 3/3442 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10537 (2013.01); H05K 2201/10636 (2013.01); Y02P 70/611 (2015.11);
Abstract

A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes disposed to face each other with at least one among the plurality of dielectric layers interposed therebetween are stacked, and the inductor including a magnetic body including a coil part. The inductor and the capacitor are coupled to each other by an adhesive containing a first epoxy resin including a urethane modified epoxy (UME) resin, a second epoxy resin including a bisphenol A type resin, and a latent curing agent.


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