The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

Jan. 31, 2018
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Jie Zhou, Jiangsu, CN;

Yoshimitsu Hamuro, Jiangsu, CN;

Shuji Tsubaki, Jiangsu, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 17/28 (2006.01); G01K 7/22 (2006.01); H01C 1/144 (2006.01); H01C 7/18 (2006.01); H01G 2/06 (2006.01); H01G 4/228 (2006.01); G01K 7/16 (2006.01); H01C 7/00 (2006.01);
U.S. Cl.
CPC ...
H01C 17/28 (2013.01); G01K 7/223 (2013.01); H01C 1/144 (2013.01); H01C 7/18 (2013.01); H01G 2/065 (2013.01); H01G 4/228 (2013.01); G01K 2007/163 (2013.01); H01C 7/008 (2013.01);
Abstract

An electronic component module with leads includes an electronic component including terminal electrodes at both ends of the electronic component body, and first and second leads including metal wires covered with insulating members and arranged side-by-side, the first and second leads are electrically connected to the terminal electrodes, wherein exposed metal wire portions where the metal wires are exposed respectively from the first and second leads are provided on joint surfaces of the first and second leads on a same side and used to join to the terminal electrodes, the exposed metal wire portion of the first lead and the exposed metal wire portion of the second lead are spaced apart from each other by a predetermined interval in a lead length direction, the terminal electrodes are electrically connected to the metal wire exposed portions of the first and second leads, respectively, by solder.


Find Patent Forward Citations

Zhou, Jie. (2019). Electronic component module with leads and method for manufacturing the same (U.S. Patent No. 10176909). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10176909

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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