The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Jan. 12, 2018
Applicant:
Seagate Technology Llc, Cupertino, CA (US);
Inventors:
Jason Bryce Gadbois, Shakopee, MN (US);
Declan Macken, Eden Prairie, MN (US);
Karsten Klarqvist, Roseville, MN (US);
Assignee:
Seagate Technology LLC, Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/48 (2006.01); G11B 5/49 (2006.01); G11B 5/00 (2006.01);
U.S. Cl.
CPC ...
G11B 5/4853 (2013.01); G11B 5/4886 (2013.01); G11B 5/4976 (2013.01); G11B 2005/0008 (2013.01); G11B 2005/0021 (2013.01);
Abstract
A bond pad set includes at least one ground pad and at least one electrical bond pad configured to bias and send/receive signals. The bond pad set is electrically connected to a multiplicity of electrical components. At least one electrical bond pad of the bond pad set is shared between two or more of the electrical components.