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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10176421 B1

PDFFull Text
Date of Patent:
Jan. 08, 2019

Filed:

Jan. 16, 2013

Method for producing a data carrier that prevents mechanical strains between chip and data carrier body

Applicant:

Giesecke & Devrient Gmbh, Munich, DE;

Inventors:

Walter Ponikwar, Burghausen, DE;

Thomas Tarantino, Laufen, DE;

Tobias Salzer, Unterhaching, DE;

Andreas Braun, Munich, DE;

Gunter Endres, Munich, DE;

Assignee:

GIESECKE+DEVRIENT MOBILE SECURITY GMBH, Munich, DE;

Attorney:

Workman Nydegger

Primary Examiner:

Steven S Paik

Assistant Examiner:

Tae W Kim

Int. Cl.
CPC ...
G06K 19/077 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07728 (2013.01); G06K 19/07722 (2013.01); G06K 19/07749 (2013.01); Y10T 29/49018 (2015.01);
Abstract

This disclosure includes a method for manufacturing a portable data carrier, an inlay for a data carrier, and a data carrier. A data carrier body has a gap for a chip and a chip is incorporated into the gap. In a subsequent step a cover layer is laid on the data carrier body, and the data carrier body and the cover layer are laminated. After the incorporation of the chip and before the lamination, a stabilizing agent is applied into the gap of the core layer, which remains soft or flexible during the lamination and cures or is activated (e.g. by means of UV radiation) only after the lamination, in order for mechanical tensions to be avoided.

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Ponikwar, Walter. (2019). Method for producing a data carrier that prevents mechanical strains between chip and data carrier body (U.S. Patent No. 10176421). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10176421

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