The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

Feb. 17, 2016
Applicant:

Heraeus Deutschland Gmbh & Co. KG, Hanau, DE;

Inventors:

Eckhard Ditzel, Linsengericht, DE;

Bernd Gehlert, Bruchköbel, DE;

Frank Krüger, Nidderau, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/12 (2006.01); C25D 3/46 (2006.01); G06K 19/077 (2006.01); C25D 5/12 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); C25D 7/06 (2006.01); C25D 3/56 (2006.01); H01L 21/48 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07722 (2013.01); C25D 3/12 (2013.01); C25D 3/46 (2013.01); C25D 3/562 (2013.01); C25D 5/12 (2013.01); C25D 7/0614 (2013.01); G06K 19/07743 (2013.01); H01L 21/4821 (2013.01); H01L 23/49534 (2013.01); H01L 23/49565 (2013.01); H01L 23/49582 (2013.01); H01L 23/49855 (2013.01); H01L 24/97 (2013.01); H01L 24/08 (2013.01); H01L 24/48 (2013.01); H01L 24/80 (2013.01); H01L 24/85 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73251 (2013.01); H01L 2224/80439 (2013.01); H01L 2224/80455 (2013.01); H01L 2224/80904 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85455 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01);
Abstract

A strip-type substrate includes a foil having a number of substrate units for producing chip card modules. The substrate has an inner face for at least partial direct or indirect contacting of a semiconductor chip and an outer face lying opposite the inner face. The foil includes of steel, in particular high-grade steel, and a first layer of nickel or a nickel alloy on at least some sections of the outer face.


Find Patent Forward Citations

Loading…