The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

Jan. 06, 2017
Applicant:

Primax Electronics Ltd., Taipei, TW;

Inventors:

Mao-Hsiu Hsu, Taipei, TW;

Li-Pin Wang, Taipei, TW;

Hong-Kai Huang, Taipei, TW;

Chih-Hao Hsu, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/20 (2006.01); G06K 9/00 (2006.01); B05D 3/02 (2006.01); B05D 3/06 (2006.01); B05D 3/12 (2006.01); B05D 5/00 (2006.01);
U.S. Cl.
CPC ...
G06K 9/00013 (2013.01); B05D 3/0254 (2013.01); B05D 3/067 (2013.01); B05D 3/12 (2013.01); B05D 5/00 (2013.01); G06K 9/00087 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01);
Abstract

A method for manufacturing a fingerprint identification module is provided. In a step (a), a fingerprint sensor comprising a substrate, a sensing chip and a package layer is provided. The sensing chip is disposed on the substrate. The sensing chip is encapsulated by the package layer. In a step (b), an ink material is coated on the package layer, so that a color ink layer is formed on the package layer. In a step (c), a stamping tool is used to stamp the color ink layer, so that a top surface of the color ink layer becomes a first high gloss surface. In a step (d), the color ink layer to be heated through baking or irradiated with UV light, so that the color ink layer is hardened.


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