The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

Feb. 18, 2014
Applicant:

Brown University, Providence, RI (US);

Inventors:

Sherief Reda, Providence, RI (US);

Abdullah Nowroz, Providence, RI (US);

Kapil Dev, Providence, RI (US);

Assignee:

Brown University, Providence, RI (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G05D 7/00 (2006.01); G05D 11/00 (2006.01); G05D 23/19 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
G05D 23/1917 (2013.01); G06F 1/203 (2013.01);
Abstract

This invention relates to a power mapping and modeling system for integrated circuits. An automated process includes determining a floor plan of the integrated circuit, dividing the integrated circuit into blocks based on the floor plan, pumping oil through an inlet valve, over the integrated circuit, and out an outlet valve to create a simulated oil-based cooling system, injecting a plurality of power pulses across the integrated circuit, applying infrared image techniques to the integrated circuit to create measured thermal images for the simulated oil-based cooling system, setting up a finite-element model (FEM) to estimate entries in a first thermal-to-power modeling matrix for the simulated oil-based cooling system, determining and storing performance monitoring counter (PMC) measurements related to power consumptions of the blocks of the integrated circuit, reconstructing a power dissipation for the simulated oil-based cooling system by using a thermal map for the simulated oil-based cooling system system, using the power dissipation of the simulated oil-based cooling system, the FEM, and the PMC measurements to create a thermal map for a copper based cooling system, and creating a final thermal-to-power model for the integrated circuit from the thermal map for the model copper based cooling system.


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