The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Jun. 30, 2016
Applied Materials, Inc., Santa Clara, CA (US);
Randy A. Harris, Kalispell, MT (US);
Michael Windham, Kalispell, MT (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A wafer is placed into a chuck assembly within an electroplating system. The chuck assembly includes a backing plate assembly engageable with a ring. A hub may be provided on one side of the backing plate assembly for attaching the chuck assembly to a rotor of a processor for electroplating a wafer. A wafer plate may be provided on the other side of the backing plate assembly. The ring has contact fingers electrically connected to a ring bus bar, and with the ring bus bar electrically connected to a power source in the processor via the backing plate assembly when the ring is engaged to the backing plate assembly. A wafer seal on the ring overlies the contact fingers. A chuck seal may be provided around a perimeter. Maintenance of the electrical contacts and the seal is performed remotely from the processors.