The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

May. 13, 2016
Applicant:

Basell Polyolefine Gmbh, Wesseling, DE;

Inventors:

Joachim Berthold, Grassau, DE;

Lutz-Gerd Heinicke, Eschborn, DE;

Gerhardus Meier, Frankfurt, DE;

Assignee:

Basell Polyolefine GmbH, Wesseling, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/06 (2006.01); C08J 5/18 (2006.01); C08L 23/04 (2006.01); C08F 2/38 (2006.01); C08L 23/08 (2006.01);
U.S. Cl.
CPC ...
C08L 23/06 (2013.01); C08J 5/18 (2013.01); C08L 23/04 (2013.01); C08L 23/0807 (2013.01); C08L 23/0815 (2013.01); C08J 2323/04 (2013.01); C08J 2323/06 (2013.01); C08J 2423/08 (2013.01); C08L 23/08 (2013.01); C08L 2203/16 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01);
Abstract

The invention relates to a polyethylene molding composition having a multimodal molar mass distribution particularly suitable for blow molding films having a thickness in the range from 8 to 200 μm. The molding composition has a density at a temperature of 23° C. in the range from 0.953 to 0.960 g/cmand an MFRof the final product after extrusion in the range from 0.10 to 0.50 dg/min. The composition comprises from 30 to 60% by weight of a first ethylene polymer fraction made of a homopolymer A having a first molecular weight, from 22 to 40% by weight of a second ethylene polymer fraction made of a further homopolymer or first copolymer B of ethylene and at least one first comonomer from the group of olefins having from 4 to 8 carbon atoms, the first copolymer B having a second molecular weight higher than the first molecular weight, and from 10 to 30% by weight of a third ethylene polymer fraction made of a second copolymer C having a third molecular weight higher than the second molecular weight. The molding composition of the invention allows to produce thin films having improved processability without impairing the mechanical properties.


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