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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10174165 B1

PDFFull Text
Date of Patent:
Jan. 08, 2019

Filed:

Apr. 20, 2015

Poly(amic acid) composition and polyimide composition

Applicant:

Jfe Chemical Corporation, Tokyo, JP;

Inventors:

Youhei Inoue, Chiba, JP;

Hiroaki Mori, Chiba, JP;

Assignee:

JFE CHEMICAL CORPORATION, Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Ana L Woodward

Int. Cl.
CPC ...
C08G 73/00 (2006.01); C08G 73/10 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 27/28 (2006.01); C08L 79/08 (2006.01); H05K 1/03 (2006.01); C09J 7/22 (2018.01); C09J 7/30 (2018.01); C09J 7/25 (2018.01);
U.S. Cl.
CPC ...
C08G 73/10 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/281 (2013.01); C08G 73/1042 (2013.01); C08G 73/1085 (2013.01); C08L 79/08 (2013.01); C09J 7/22 (2018.01); C09J 7/25 (2018.01); C09J 7/30 (2018.01); H05K 1/0346 (2013.01); B32B 2307/206 (2013.01); B32B 2307/734 (2013.01); B32B 2457/08 (2013.01); C09J 2203/326 (2013.01); C09J 2477/00 (2013.01); C09J 2479/086 (2013.01); H05K 2201/0154 (2013.01);
Abstract

There is provided a polyimide composition that is useful for electronic substrate materials, retains high heat resistance and mechanical strength intrinsic to polyimides, and has a lower dielectric constant and dielectric loss tangent. A polyimide composition for use in electronic substrate materials, containing a polyimide produced by polymerization between a diamine component containing 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindan and an acid component containing 3,3',4,4′-biphenyltetracarboxylic acid dianhydride.

Find Patent Forward Citations

Inoue, Youhei. (2019). Poly(amic acid) composition and polyimide composition (U.S. Patent No. 10174165). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10174165

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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