The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Nov. 09, 2015
Applicant:
Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;
Inventors:
Yasuyuki Horii, Ome Tokyo, JP;
Kazuo Ito, Mitaka Tokyo, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01); B29C 70/54 (2006.01); B32B 1/02 (2006.01); B29C 43/02 (2006.01); H05K 5/00 (2006.01); B32B 3/02 (2006.01); B32B 3/08 (2006.01); H05K 5/03 (2006.01); B29K 101/12 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B32B 1/02 (2013.01); B29C 43/021 (2013.01); B29C 70/54 (2013.01); B29C 70/545 (2013.01); B32B 3/02 (2013.01); B32B 3/08 (2013.01); H05K 5/0004 (2013.01); H05K 5/0017 (2013.01); H05K 5/0026 (2013.01); H05K 5/0047 (2013.01); H05K 5/0069 (2013.01); H05K 5/02 (2013.01); H05K 5/03 (2013.01); B29K 2101/12 (2013.01); B29L 2031/3481 (2013.01);
Abstract
According to one embodiment, a fiber molded article includes fiber impregnated with thermoplastic resin, a plane base portion molded from the fiber, and a wall portion molded from the fiber and extending to an outside of a surface of the base portion to form an outer edge of the base portion. The wall portion has a through-hole. An entire periphery of an inner peripheral surface of the through-hole is covered with a film. The film is formed by melting the thermoplastic resin soaked into the fiber on the inner peripheral surface.