The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

Apr. 08, 2016
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventor:

Manabu Tateno, Suntou-gun, JP;

Assignee:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B29C 65/54 (2006.01); C25D 11/04 (2006.01); C22C 21/00 (2006.01); B32B 15/01 (2006.01); C25D 11/24 (2006.01); F02F 3/10 (2006.01);
U.S. Cl.
CPC ...
B29C 65/54 (2013.01); B32B 15/016 (2013.01); C22C 21/00 (2013.01); C25D 11/04 (2013.01); C25D 11/24 (2013.01); C25D 11/246 (2013.01); F02F 3/10 (2013.01);
Abstract

A second heat-shielding filmproduced by anodizing treatment of both surfaces of pure Al foil with an Al purity equal to or larger than 99.0% is disposed on a surface of a first heat-shielding filmthat is formed by anodizing treatment of a surface of a combustion chamber configuring componentformed from an Al alloy (Al purity of less than 99.0%) as a based material. A heat resistant adhesive is poured from between these heat-shielding films, and the heat resistant adhesive is heated and cured (an intermediate layer). Since the second heat-shielding film has low surface roughness Ra of an average of approximately 1.0 μm even in an unpolished state, polishing or the like for the film with an objective of smoothing after bonding of the second heat-shielding film can be omitted. Further, the heat-shielding film structure with a smoothed surface can be provided.


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