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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10173370 B1

PDFFull Text
Expired
Date of Patent:
Jan. 08, 2019

Filed:

Mar. 26, 2015

Joining method

Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventors:

Yasuhiro Ueno, Miyoshi, JP;

Takaaki Kiyono, Okazaki, JP;

Toyokazu Hirota, Okazaki, JP;

Koichi Inazawa, Miyoshi, JP;

Tatsuro Nakata, Toyota, JP;

Assignee:

TOYOTA JIDOSHA KABUSHIKI KAISHA, Aichi-ken, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

James D Sells

Int. Cl.
CPC ...
B32B 37/00 (2006.01); B29C 65/06 (2006.01); B21D 39/03 (2006.01); B21J 15/02 (2006.01); B23K 20/12 (2006.01); B29C 65/60 (2006.01); B29C 65/64 (2006.01); B29C 65/78 (2006.01); B29C 65/00 (2006.01); B29C 65/02 (2006.01); F16B 5/04 (2006.01); F16B 5/08 (2006.01); B23K 20/22 (2006.01); B23K 20/233 (2006.01); B21K 25/00 (2006.01); B23K 103/16 (2006.01); B23K 103/18 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B29C 65/06 (2013.01); B21D 39/032 (2013.01); B21J 15/027 (2013.01); B21K 25/005 (2013.01); B23K 20/127 (2013.01); B23K 20/1255 (2013.01); B23K 20/22 (2013.01); B23K 20/233 (2013.01); B29C 65/02 (2013.01); B29C 65/0681 (2013.01); B29C 65/606 (2013.01); B29C 65/608 (2013.01); B29C 65/64 (2013.01); B29C 65/7841 (2013.01); B29C 66/1122 (2013.01); B29C 66/21 (2013.01); B29C 66/41 (2013.01); B29C 66/45 (2013.01); B29C 66/72143 (2013.01); B29C 66/73116 (2013.01); B29C 66/81431 (2013.01); B29C 66/8322 (2013.01); F16B 5/045 (2013.01); F16B 5/08 (2013.01); B23K 2103/16 (2018.08); B23K 2103/18 (2018.08); B23K 2103/42 (2018.08); B29C 66/71 (2013.01); B29C 66/7212 (2013.01); B29C 66/742 (2013.01);
Abstract

A joining method for joining a first member having a hole that is opened on at least one surface, to a second member including a material of which a melting temperature is lower than that of a constituent material of the first member, includes: laminating the second member on the first member so as to cover an opening of the hole; and introducing that material of the second member which is softened or melted into the hole through the opening and curing the material of the second member.

Find Patent Forward Citations

Ueno, Yasuhiro. (2019). Joining method (U.S. Patent No. 10173370). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10173370

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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