The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Jan. 31, 2014
Applicant:
Nissan Motor Co., Ltd., Yokohama-shi, Kanagawa, JP;
Inventors:
Hiroshi Sakurai, Chigasaki, JP;
Shigeyuki Nakagawa, Yokosuka, JP;
Akira Fukushima, Zama, JP;
Sadao Yanagida, Yokosuka, JP;
Chika Sugi, Tokyo, JP;
Assignee:
Nissan Motor Co., Ltd., Yokohama-shi, Kanagawa, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 11/11 (2006.01); B23K 31/02 (2006.01); B23K 11/20 (2006.01); B23K 26/323 (2014.01); B23K 26/22 (2006.01); B23K 101/34 (2006.01); B23K 103/10 (2006.01); B23K 103/14 (2006.01); B23K 103/18 (2006.01); B23K 103/20 (2006.01); B23K 103/24 (2006.01);
U.S. Cl.
CPC ...
B23K 11/115 (2013.01); B23K 11/20 (2013.01); B23K 26/22 (2013.01); B23K 26/323 (2015.10); B23K 2101/34 (2018.08); B23K 2103/10 (2018.08); B23K 2103/14 (2018.08); B23K 2103/18 (2018.08); B23K 2103/20 (2018.08); B23K 2103/24 (2018.08); Y10T 428/12736 (2015.01);
Abstract
Disclosed herein are bonded structures and methods of forming the same. One embodiment of a bonded structure comprises first and second metallic layers and a bonding interface between the first and second metallic layers formed by diffusion and comprising a layer of at least one intermetallic compound. The intermetallic compound layer is formed in an area 52% or greater of an area of the bonding interface and has a thickness of 0.5 to 3.2 μm.