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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10173253 B1

PDFFull Text
Date of Patent:
Jan. 08, 2019

Filed:

Jul. 23, 2014

Methods for the development of commercial scale nano-engineered ultraconductive copper wire

Applicant:

Cleveland State University, Cleveland, OH (US);

Inventors:

Taysir H. Nayfeh, Cleveland, OH (US);

Anita M. Wiederholt, Sheffield Village, OH (US);

Assignee:

CLEVELAND STATE UNIVERSITY, Cleveland, OH (US);

Attorney:

Fay Sharpe LLP

Primary Examiner:

Donghai D Nguyen

Int. Cl.
CPC ...
H01L 39/24 (2006.01); B21C 23/00 (2006.01); B21C 37/04 (2006.01); B22F 3/00 (2006.01); B22F 3/16 (2006.01); B22F 3/20 (2006.01); B22F 7/06 (2006.01); B30B 11/26 (2006.01); C22C 47/14 (2006.01); C22C 49/02 (2006.01); C22C 49/04 (2006.01); H01B 1/02 (2006.01); B30B 11/00 (2006.01); B22D 17/04 (2006.01); B22D 19/02 (2006.01);
U.S. Cl.
CPC ...
B21C 23/002 (2013.01); B21C 23/001 (2013.01); B21C 37/04 (2013.01); B21C 37/047 (2013.01); B22D 17/04 (2013.01); B22D 19/02 (2013.01); B22F 3/003 (2013.01); B22F 3/16 (2013.01); B22F 3/20 (2013.01); B22F 7/06 (2013.01); B30B 11/007 (2013.01); B30B 11/26 (2013.01); C22C 47/14 (2013.01); C22C 49/02 (2013.01); C22C 49/04 (2013.01); H01B 1/02 (2013.01); H01B 1/026 (2013.01); H01L 39/24 (2013.01); B22F 2003/206 (2013.01); B22F 2003/208 (2013.01); Y10T 29/49014 (2015.01);
Abstract

When forming ultra-conductive wire, multi-walled carbon nanotubes (MWCNTs) are dispersed and de-agglomerated in hot metal. The MWCNTs are dispersed in a precursor matrix via mixing and sintering to form precursor material, which is hot-extruded multiple rounds at a predetermined temperature to form a nano-composite material. The nano-composite material is inserted into a metal bar to form a nano-composite billet (), which is subjected to multiple rounds of hot extrusion to form an ultra-conductive material. The ultra-conductive material is subjected to one or more rounds of hot wire drawing to form an ultra-conductive wire comprising a nano-composite filament.

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