The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Sep. 22, 2016
Applicant:

Yamaha Hatsudoki Kabushiki Kaisha, Iwata-shi, Shizuoka-ken, JP;

Inventors:

Seiji Ohnishi, Kumagaya, JP;

Koichi Izuhara, Iwata, JP;

Hiroyuki Watanabe, Kumagaya, JP;

Takashi Yoshii, Kumagaya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0404 (2013.01); H05K 13/04 (2013.01); H05K 13/0406 (2018.08);
Abstract

A component mounting device includes a mounting head that is movable in a horizontal direction and mounts a held component on a substrate and a control portion that controls the operation of the mounting head. The control portion is configured to perform control of a speed of mounting, by the mounting head, of a component to be located closely adjacent to another component and to be mounted on the substrate such that an interval to an adjacent component is equal to or less than a predetermined threshold, on the substrate. A speed of mounting of the component is less than a speed of mounting in a normal state in which the mounting head mounts a component, which is not the component to be located closely adjacent to another component, on the substrate.


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