The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Nov. 14, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Bruce J. Chamberlin, Vestal, NY (US);

Scott B. King, Rochester, NY (US);

Joseph Kuczynski, North Port, FL (US);

David J. Russell, Owego, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 3/40 (2006.01); H05K 3/22 (2006.01); H05K 3/46 (2006.01); H05K 1/11 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4076 (2013.01); H05K 1/09 (2013.01); H05K 1/116 (2013.01); H05K 3/22 (2013.01); H05K 3/4644 (2013.01); H05K 2201/095 (2013.01); H05K 2201/09372 (2013.01); H05K 2203/10 (2013.01); H05K 2203/11 (2013.01);
Abstract

In some embodiments, methods include drilling one or a plurality of PTHs with any industrial grade drill to fabricate holes with positive etch back, flooding the PTHs with a dilute solution of an acrylate monomer/oligomer containing an appropriate level of peroxide initiator, polymerizing the acrylate, and then rising the PTHs with the solvent used in the formulation of the acrylate material. In one embodiment, the printed circuit board may include a substrate comprising a plurality of metal layers separated by a plurality of insulating layers; a plurality of plated through holes formed in the substrate, each plated through hole comprising: recesses formed at each insulating layer, copper lands between the recesses, a polymer coating in each recess, and a metal layer lining the plated through hole.


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