The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Feb. 08, 2017
Applicant:

Automated Assembly Corporation, Lakeville, MN (US);

Inventor:

Robert Neuman, Cannon Falls, MN (US);

Assignee:

Automated Assembly Corporation, Lakeville, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H05K 3/32 (2006.01); H01L 23/00 (2006.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/32 (2013.01); H01L 21/4846 (2013.01); H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 21/563 (2013.01); H01L 23/3135 (2013.01); H01L 23/3157 (2013.01); H01L 23/4985 (2013.01); H01L 23/49883 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); H05K 1/189 (2013.01); H05K 3/321 (2013.01); H05K 3/3426 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/85201 (2013.01); H01L 2224/85423 (2013.01); H01L 2224/85447 (2013.01); H01L 2224/85801 (2013.01); H01L 2224/92147 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1207 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1421 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01); H05K 3/284 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/049 (2013.01); Y02P 70/613 (2015.11);
Abstract

A disclosed circuit arrangement includes a flexible substrate. A layer of pressure sensitive adhesive (PSA) is directly adhered to a first major surface of the substrate. One or more metal foil pads and electrically conductive wire are attached directly on a surface of the PSA layer. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly on the surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.


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