The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Jun. 13, 2017
Applicants:

Benjamin Andrew Copley, Linthicum, MD (US);

Matthew S. Torpey, Ellicott City, MD (US);

David J. Gillooly, Glen Burnie, MD (US);

Justin B. Kennard, Liberty Township, OH (US);

Andrew S. King, Baltimore, MD (US);

Inventors:

Benjamin Andrew Copley, Linthicum, MD (US);

Matthew S. Torpey, Ellicott City, MD (US);

David J. Gillooly, Glen Burnie, MD (US);

Justin B. Kennard, Liberty Township, OH (US);

Andrew S. King, Baltimore, MD (US);

Assignee:

Northrop Grumman Systems Corporation, Falls Church, VA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0216 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 2201/0723 (2013.01);
Abstract

A surface mount technology (SMT) device can include an SMT interface on a given side of the SMT device. The SMT interface can include an interface ground plane formed of conductive material. The SMT interface can also include a plurality of signal pads formed of the conductive material. Each signal pad can be encircled by one of a plurality of isolation regions formed from a non-conductive region of the SMT interface. The SMT device is configured for mounting on a printed wiring board (PWB) that includes a board interface having substantially the same shape at the SMT interface.


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