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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10171059 B1

PDFFull Text
Date of Patent:
Jan. 01, 2019

Filed:

Jan. 27, 2017

Composite component and front-end module

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventor:

Seigo Hino, Kyoto, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Dinh T Le

Int. Cl.
CPC ...
H03H 7/01 (2006.01); H05K 7/14 (2006.01); H03F 3/19 (2006.01); H01L 25/00 (2006.01); H04B 1/40 (2015.01); H03F 3/24 (2006.01); H03H 9/46 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H03H 9/05 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H03H 7/0115 (2013.01); H01L 25/00 (2013.01); H03F 3/19 (2013.01); H03F 3/245 (2013.01); H03H 7/0161 (2013.01); H03H 7/175 (2013.01); H03H 7/1766 (2013.01); H03H 9/46 (2013.01); H04B 1/40 (2013.01); H05K 1/0243 (2013.01); H05K 1/141 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H01L 2924/0002 (2013.01); H03F 2200/451 (2013.01); H03H 9/0566 (2013.01); H05K 1/0218 (2013.01); H05K 2201/042 (2013.01); H05K 2201/0723 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/2036 (2013.01);
Abstract

An object is to provide a technique that can reduce the degradation in the characteristics of a transmitting filter by improving heat dissipation characteristics of a composite component having a stack structure. Since a transmitting filter is disposed in or on a first substrate, the heat generated in the transmitting filter is efficiently dissipated, for example, to an external module substrateelectrically connected to the first substrate. It is thus possible to reduce changes in the characteristics of the transmitting filter caused by a temperature rise. Thus, by improving heat dissipation characteristics of a composite componenthaving a stack structure, the degradation in the characteristics of the transmitting filter can be reduced.

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Hino, Seigo. (2019). Composite component and front-end module (U.S. Patent No. 10171059). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10171059

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