The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Jul. 16, 2015
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Inventors:

Tomoya Aoyama, Kanagawa, JP;

Ryu Komatsu, Kanagawa, JP;

Takayuki Ohide, Tochigi, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 51/00 (2006.01); H01L 21/768 (2006.01); H01L 25/075 (2006.01); G02F 1/13357 (2006.01); G02B 6/00 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01); G02F 1/1335 (2006.01); F21S 6/00 (2006.01); F21Y 105/10 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H01L 33/005 (2013.01); G02B 6/00 (2013.01); G02F 1/1336 (2013.01); H01L 21/76825 (2013.01); H01L 25/0753 (2013.01); H01L 51/0097 (2013.01); H05K 1/189 (2013.01); H05K 3/323 (2013.01); F21S 6/00 (2013.01); F21Y 2105/10 (2016.08); F21Y 2115/10 (2016.08); G02F 2001/133614 (2013.01); G02F 2202/108 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method for manufacturing a circuit board includes a first process, a second process, a third process, and a fourth process. The first process includes a step of providing a circuit and an electrode over a first surface of a first substrate. The second process includes a step of providing a reflective layer on the first surface side of the first substrate or a second surface side of a second substrate. The third process includes a step of attaching the first surface and the second surface to each other with a bonding layer therebetween to face each other so that the reflective layer overlaps with the electrode and the reflective layer surrounds part of the electrode. The fourth process includes a step of irradiating at least part of the reflective layer with laser light from a side opposite to the electrode.


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