The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2019
Filed:
Feb. 19, 2016
Applicant:
Toshiba Memory Corporation, Tokyo, JP;
Inventors:
Assignee:
Toshiba Memory Corporation, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/11 (2006.01); H01L 27/11582 (2017.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 28/00 (2013.01);
Abstract
According to one embodiment, a semiconductor device includes an underlying metal film and a metal film. The underlying metal film is a tantalum-aluminum film having an aluminum content of more than 50 atomic % and less than 85 atomic %, a tungsten-zirconium film having a zirconium content of less than 40 atomic %, a tungsten-titanium film having a titanium content of less than 80 atomic %, or a tungsten film. The metal film is provided on the underlying metal film and in contact with the underlying metal film. The metal film contains at least one of tungsten and molybdenum, and has a main orientation of (100) or (111).