The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Mar. 05, 2018
Applicant:

Mediatek Singapore Pte. Ltd, Singapore, SG;

Inventors:

Chiyuan Lu, San Jose, CA (US);

Chien-Chih Lin, Hsinchu, TW;

Cheng-Chou Hung, Hukou Township, Hsinchu County, TW;

Yu-Hua Huang, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/332 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/768 (2006.01); H01L 23/58 (2006.01); H01L 21/761 (2006.01); H01L 29/06 (2006.01); H01L 27/08 (2006.01); H01L 29/872 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 21/761 (2013.01); H01L 21/76802 (2013.01); H01L 23/498 (2013.01); H01L 23/585 (2013.01); H01L 29/0623 (2013.01); H01L 27/0814 (2013.01); H01L 29/872 (2013.01); H01L 2924/00 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method for forming a seal ring structure provides a semiconductor substrate having a first doping region formed over a top portion thereof. The method forms a plurality of patterned photoresist layers over the semiconductor substrate, encircling the semiconductor substrate, wherein each of the patterned photoresist layers has a plurality of parallel strip portions extending along a first direction and a plurality of bridge portions formed between the parallel strip portions, and then performs an etching process to a first doping region of the substrate. The method then removes the first doping region not covered by the patterned photoresist layers and forms a plurality of patterned first doping regions. The method then removes the patterned photoresist layers and forms an isolation region between and adjacent to the patterned first doping regions. Finally, the method forms a plurality of interconnect elements over the semiconductor substrate.


Find Patent Forward Citations

Loading…