The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2019
Filed:
May. 19, 2017
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Tae Hyun Kim, Suwon-si, KR;
Thomas A. Kim, Suwon-si, KR;
Kyu Bum Han, Suwon-si, KR;
Tae Hoon Kim, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 21/00 (2006.01); H05K 7/20 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 25/03 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 23/5328 (2013.01); H01L 23/5389 (2013.01); H01L 23/53209 (2013.01); H01L 23/53214 (2013.01); H01L 23/53219 (2013.01); H01L 23/53228 (2013.01); H01L 23/53233 (2013.01); H01L 23/53242 (2013.01); H01L 23/53247 (2013.01); H01L 23/552 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/03 (2013.01); H01L 25/105 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16227 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A semiconductor package includes a frame having a through hole, an electronic component disposed in the through hole, a metal layer disposed on either one or both of an inner surface of the frame and an upper surface of the electronic component, a redistribution portion disposed below the frame and the electronic component, and a conductive layer connected to the metal layer.