The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

May. 09, 2017
Applicants:

Joseph Smith, Tempe, AZ (US);

Emmett Howard, Tempe, AZ (US);

Jennifer Blain Christen, Chandler, AZ (US);

Yong-kyun Lee, Chandler, AZ (US);

Inventors:

Joseph Smith, Tempe, AZ (US);

Emmett Howard, Tempe, AZ (US);

Jennifer Blain Christen, Chandler, AZ (US);

Yong-Kyun Lee, Chandler, AZ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 27/12 (2006.01); H01L 21/306 (2006.01); H01L 29/786 (2006.01); H01L 21/683 (2006.01); H01L 27/32 (2006.01); H01L 21/768 (2006.01); H01L 27/146 (2006.01); H01L 27/15 (2006.01); H01L 23/31 (2006.01); H01L 23/15 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4985 (2013.01); H01L 21/30604 (2013.01); H01L 21/6835 (2013.01); H01L 21/768 (2013.01); H01L 23/3192 (2013.01); H01L 27/1218 (2013.01); H01L 27/1262 (2013.01); H01L 27/14636 (2013.01); H01L 27/153 (2013.01); H01L 27/3293 (2013.01); H01L 29/78603 (2013.01); A61B 2562/02 (2013.01); A61B 2562/164 (2013.01); H01L 23/15 (2013.01); H01L 27/14603 (2013.01); H01L 27/156 (2013.01); H01L 29/786 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68381 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Some embodiments include a method of providing an electronic device. The method can comprise: providing a first device substrate; providing one or more first active sections over a second side of the first device substrate at a first device portion of the first device substrate; and after providing the first active section(s) over the second side of the first device substrate at the first device portion, folding a first perimeter portion of the first device substrate toward the first device portion at a first side of the first device substrate so that a first edge portion remains to at least partially frame the first device portion. The first edge portion can comprise a first edge portion width dimension smaller than a first smallest cross dimension of one or more pixel(s) of one or more semiconductor device(s) of the first active section(s). Other embodiments of related methods and devices are also disclosed.


Find Patent Forward Citations

Loading…