The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Feb. 11, 2016
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Yosuke Imazeki, Tokyo, JP;

Soshi Kuroda, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/06 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 24/97 (2013.01); H01L 25/065 (2013.01); H01L 25/0657 (2013.01); H01L 21/561 (2013.01); H01L 23/3128 (2013.01); H01L 23/49894 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/78 (2013.01); H01L 24/83 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/0612 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/48479 (2013.01); H01L 2224/48499 (2013.01); H01L 2224/48624 (2013.01); H01L 2224/48644 (2013.01); H01L 2224/48824 (2013.01); H01L 2224/48844 (2013.01); H01L 2224/4917 (2013.01); H01L 2224/4945 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/49431 (2013.01); H01L 2224/49433 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/85181 (2013.01); H01L 2224/85186 (2013.01); H01L 2224/85203 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85986 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/97 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06568 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10271 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract

A semiconductor device includes a wiring substrate having an upper surface, a plurality of terminals formed on the upper surface, and a lower surface opposite to the upper surface, a first semiconductor chip having a first main surface, a plurality of first electrodes formed on the first main surface, and a first rear surface opposite to the first main surface, and mounted over the upper surface of the wiring substrate such that the first rear surface of the first semiconductor chip faces the upper surface of the wiring substrate, and a plurality of wires electrically connected with the plurality of terminals, respectively.


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