The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Jul. 15, 2016
Applicant:

Mosway Technologies Limited, Tsuen Wan, Hong Kong, CN;

Inventors:

Celement Chiu Sing Tse, Hong Kong, CN;

Peter On Bon Chan, Hong Kong, CN;

Chi Keung Tang, Hong Kong, CN;

Assignee:

Mosway Technologies Limited, Tsuen Wan, Hong Kong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/3677 (2013.01); H01L 23/3735 (2013.01); H01L 23/49531 (2013.01); H01L 23/49562 (2013.01); H01L 23/49551 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49111 (2013.01); H01L 2924/181 (2013.01);
Abstract

An integrated power module comprising a power board including at least one power switching device, a driver board including at least one driver for driving a gate of the at least one power switching device, and an interconnection extending across the power board and the driver board mechanically connecting the power board and the driver board together. Included are a lead frame to which the power board and the driver board are mounted, and a package encapsulating the power board and the driver board mounted on the lead frame. Also disclosed is a method for manufacturing the integrated power module.


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